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  ? semiconductor components industries, llc, 2003 october, 2016 ? rev. 7 1 publication order number: sm05t1/d sm05t1gseries, SZSM05T1G transient voltage suppressor diode array sot?23 dual common anode diodes for esd protection these dual monolithic silicon tvs diodes are designed for applications requiring transient overvoltage protection capability. they are intended for use in voltage and esd sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. their dual junction common anode design protects two separate lines using only one package. these devices are ideal for situations wh ere board space is at a premium. specification features: ? sot?23 package allows either two separate unidirectional configurations or a single bidirectional configuration ? working peak reverse voltage range ? 5.0 v to 24 v ? peak power ? 300 watt (8 x 20  s) ? low leakage ? flammability rating ul 94 v?0 ? sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these are pb?free devices mechanical characteristics: case: void-free, transfer-molded, thermosetting plastic case finish: corrosion resistant finish, easily solderable maximum case temperature for soldering purposes: 260 c for 10 seconds package designed for optimal automated board assembly small package size for high density applications available in 8 mm tape and reel use the device number to order the 7 inch/3,000 unit reel replace the ?t1? with ?t3? in the device number to order the 13 inch/10,000 unit reel sot?23 case 318 style 12 1 3 2 pin 1. cathode 2. cathode 3. anode marking diagram device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. sm05t1g sot?23 (pb?free) 3,000/tape & reel sm12t1g sot?23 (pb?free) 3,000/tape & reel *date code orientation and/or overbar may vary depending upon manufacturing location. 1 xxm m   xxm = device code xx = 05, 12, 15, 24, 36 m = date code*  = pb?free package (note: microdot may be in either location) sm15t1g sot?23 (pb?free) 3,000/tape & reel sm24t1g sot?23 (pb?free) 3,000/tape & reel sm36t1g sot?23 (pb?free) 3,000/tape & reel SZSM05T1G sot?23 (pb?free) 3,000/tape & reel www. onsemi.com
sm05t1g series, SZSM05T1G www. onsemi.com 2 maximum ratings rating symbol value unit peak power dissipation @ 20  s (note 1) @ t l 25 c p pk 300 w iec 61000?4?2 (esd) air contact 15 8.0 kv iec 61000?4?4 (eft) 40 a iec 61000?4?5 (lightening) 12 a total power dissipation on fr?5 board (note 2) @ t a = 25 c derate above 25 c thermal resistance, junction?to?ambient p d r  ja 225 1.8 556 mw mw/ c c/w total power dissipation on alumina substrate (note 3) @ t a = 25 c derate above 25 c thermal resistance, junction?to?ambient p d r  ja 300 2.4 417 mw mw/ c c/w junction and storage temperature range t j , t stg ? 55 to +150 c lead solder temperature ? maximum (10 second duration) t l 260 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. non?repetitive current pulse per figure 3 2. fr?5 = 1.0 x 0.75 x 0.62 in. 3. alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina note: other voltages may be available upon request electrical characteristics unidirectional (circuit tied to pins 1 and 3 or 2 and 3) symbol parameter i pp maximum reverse peak pulse current v c clamping voltage @ i pp v rwm working peak reverse voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current  v br maximum temperature coefficient of v br i f forward current v f forward voltage @ i f z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk uni?directional tvs i pp i f v i i r i t v rwm v c v br v f electrical characteristics (t a = 25 c unless otherwise noted) device* device marking v rwm i r @ v rwm v br , breakdown voltage i t v c @ i pp = 1 amp max i pp (note 4) typical capacitance (volts) (pf) (volts) (  a) min max ma (volts) (amps) pin 1 to 3 @ 0 volts sm05t1g 05m 5 10 6.2 7.3 1.0 9.8 17 225 sm12t1g 12m 12 1.0 13.3 15.75 1.0 19 12 95 sm15t1g 15m 15 1.0 16.7 19.6 1.0 24 10 100 sm24t1g 24m 24 1.0 26.7 31.35 1.0 43 5.0 60 sm36t1g 36m 36 1.0 40.0 46.95 1.0 60 4.0 45 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 4. 8 20  s pulse waveform per figure 3 *include sz-prefix devices where applicable.
sm05t1g series, SZSM05T1G www. onsemi.com 3 typical characteristics 0.1 10 10 figure 1. non?repetitive peak pulse power versus pulse time 1 t p , pulse duration (  s) 100 1000 1 0.1 0.01 figure 2. steady state power derating curve p pp , peak pulse power (kw) 0 25 50 75 100 125 150 175 300 250 200 150 100 50 0 temperature ( c) fr?5 board alumina substrate p d , power dissipation (mw) 100 figure 3. 8 20  s pulse waveform figure 4. typical diode capacitance (sm05) 01 5 24 250 130 90 bias voltage (volts) 90 80 70 60 50 40 30 20 10 0 020406080 t, time (  s) t p t r pulse width (t p ) is defined as that point where the peak current decay = 8  s half value i rsm /2 @ 20  s % of peak pulse current peak value i rsm @ 8  s c, capacitance (pf) 210 170 figure 5. typical diode capacitance (sm12) 015812 100 90 40 30 20 10 0 bias voltage (volts) c, capacitance (pf) 80 70 60 50 3
sm05t1g series, SZSM05T1G www. onsemi.com 4 typical common anode applications a quad junction common anode design in a sot?23 package protects four separate lines using only one package. this adds flexibility and creativity to pcb design especially when board space is at a premium. two simplified examples of tvs applications are illustrated below. keyboard terminal printer etc. functional decoder i/o a sm05t1g series gnd computer interface protection b c d microprocessor protection i/o ram rom clock cpu control bus address bus data bus gnd v gg v dd sm05t1 series sm05t1g series
sm05t1g series, SZSM05T1G www. onsemi.com 5 package dimensions sot?23 (to?236) case 318?08 issue ar d a1 3 1 2 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of the base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. soldering footprint* view c l 0.25 l1 e e e b a see view c dim a min nom max min millimeters 0.89 1.00 1.11 0.035 inches a1 0.01 0.06 0.10 0.000 b 0.37 0.44 0.50 0.015 c 0.08 0.14 0.20 0.003 d 2.80 2.90 3.04 0.110 e 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 l 0.30 0.43 0.55 0.012 0.039 0.044 0.002 0.004 0.017 0.020 0.006 0.008 0.114 0.120 0.051 0.055 0.075 0.080 0.017 0.022 nom max l1 h 2.10 2.40 2.64 0.083 0.094 0.104 h e 0.35 0.54 0.69 0.014 0.021 0.027 c 0 ??? 10 0 ??? 10 t t 3x top view side view end view 2.90 0.80 dimensions: millimeters 0.90 pitch 3x 3x 0.95 recommended *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. style 12: pin 1. cathode 2. cathode 3. anode on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular pu rpose, nor does on semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without li mitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, regulatio ns and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semicond uctor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typicals? mus t be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the rights of others. on semiconduc tor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or si milar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semiconductor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, cost s, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer . this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 sm05t1/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?


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